What is the difference between SPI and AOI in PCBA SMT?

After SPI is used in printing machines, it is used for quality inspection of solder printing and verification and control of printing processes. SPI plays a significant role in the entire SMT process. AOI is divided into two types: pre furnace and post furnace, with the former detecting device mounting and the latter detecting solder joints.

The two have different functions, SPI detects solder paste printing, AOI inspects the stability of cracked parts before the furnace, and inspects welding quality after the furnace. SMT, short for Surface Mount Technology, is currently the most popular technology and process in the electronic assembly industry. AOI stands for Automatic Organic Inspection, also known as Automatic Optical Inspection. It utilizes high-speed precision visual processing technology to detect various types of misalignment and soldering defects on PCBs. 【 SPI 】 is the abbreviation for solder paste inspection, also known as solder paste testing, which is the quality inspection of solder printing and the verification and control of printing processes.

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